Multilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF Circuit

Product Details
Type: Fixed Inductor
Structure: Inductive Choke
Working Frequency: High Frequency
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  • Multilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF Circuit
  • Multilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF Circuit
  • Multilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF Circuit
  • Multilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF Circuit
  • Multilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF Circuit
  • Multilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF Circuit
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  • Overview
  • Product Description
  • Detailed Photos
  • Product Parameters
  • Company Profile
Overview

Basic Info.

Model NO.
SDCL1005C0N6TDF
Structure of Winding
Multilayer Coil
Nature of Operation
High Self-Resonant Frequency
Structure of Magnetizer
Tubular Coil
Range of Application
Resonance
Packaging Form
Chip Inductance
Brand
FT
Inductor Value
Fixed Inductor
Lead Time
2-4weeks
Transport Package
Carton
Specification
SDCL0603Q18NT02B03
Trademark
FT
Origin
China
HS Code
8504500000
Production Capacity
50000000pieces/Year

Product Description

Product Description

Multilayer Chip Ceramic Inductor - SDCL0402H-01 Series

1. Monolithic structure for high reliability
2. High self-resonant frequency
3. Excellent solderability and high heat resistance

Detailed Photos

Multilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF Circuit
Multilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF CircuitMultilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF CircuitMultilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF CircuitMultilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF CircuitMultilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF Circuit
 

Product Parameters

Multilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF Circuit
Multilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF Circuit
 

 

Company Profile

Multilayer Chip Ceramic Inductor 0.1Ω 0.6nh 800mA for RF Circuit

 

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